Elbit Systems EW and SIGINT – Elisra (Elisra) develops and manufactures advanced microwave modules which are the major building blocks of our cutting-edge systems. These modules comply with the stringent requirements of local and international electronic equipment manufacturers, and result in the development of microwave subsystems that enable the creation of systems that are fully optimized for both performance and cost. Solid-state high-power Radio Frequency (RF) amplifiers and a range of integrated multi-function microwave modules involved multi-layer technology enable customers to conform to rigorous design and production specifications, and to comply with the end-user requirements regarding performance and reliability.
Solid-State High-Power RF Amplifiers
Elisra is a technological leader in the design and development of a wide range of reliable solid-state high-power RF amplifiers for ECM and communications applications. These advanced amplifiers enable sophisticated real-time control of amplitude and phase. In addition, these products offer high-speed solid-state switching and frequency-hopping technologies. Their flexible production facilities enable rapid cost-effective handling of customized orders and deal with most methods of environmental testing. Tests are performed during R&D qualification (MIL-STD-810), and environmental stress screening (utilizing MIL-STD-2164) is applied on all amplifiers.
Integrated Multi-Function Microwave Modules
Elisra’s microwave modules are miniature subsystems consisting of numerous microwave components that are integrated into a compact package. The package includes diverse components such as amplifiers, PIN diode control devices, oscillators, filters, and monolithic microwave integrated circuit (MMIC) devices. Our advanced miniature subsystems capabilities cover in-house MMIC development, testing, and integration. Every component is carefully designed and adapted to meet customized performance specifications. In cases in which there is a critical size limitation, an RF multilayer technology is implemented in the module design. Its characteristics can include: RF signal distribution within several layers in a single printed circuit; mixed intermediary frequency (RF), IF and digital functions and integrations; printed passive components within the inner layers; and enhanced isolation between channels.